Head of CMOS Platforms Business Unit Packaging Solutions

Job summary
The CMOS Business Unit Packaging Product Management Director is responsible for driving the business results of the complete portfolio of packaging product offerings across our technology platforms. This includes packaging solutions from Bump/Probe to Turnkey and 2.5/3D applications spanning all market applications for GF. This role owns product offering planning and definition and roadmap, differentiation, competitiveness analysis and positioning, product offering extensions, alignment with Segment on TAM/SAM assumptions, sub-segment opportunity selection, offering strategy, business planning, business case development and approval, management of product line P&L, go-to-market collateral development, customer engagement on product line planning, analysis of asset utilization and overall management of decisions on the product line.
This role will work closely with the Product Line owners for the CMOS, and RF offerings as well as Packaging Technology organization to create a comprehensive portfolio of packaging offerings that are integral to, and build upon integrated solutions at the system level.
This role reports to our VP, Leading Edge CMOS Offering Management and is based in Malta, NY or alternate US site. There will be travel up to 20% of the time both domestically and internationally.
Specific responsibilities include:
Product offering defintion and Program planning including development and execution for packaging and interconnect projects
Own P/L for packaging product lines (Turnkey services, Bump and probe, Si interposer) including pricing strategies
Develop and maintain GLOBALFOUNDRIES packaging and interconnect roadmaps.
Develop deep relationships with decision-makers at customers in architecture, design, packaging, and planning groups to drive sale and development of more differentiated products.
Guide GLOBALFOUNDRIES Packaging development priorities and setup Turnkey services business models that enable new revenue streams for GLOBALFOUNDRIES.
Translate customer application needs into requirements for GLOBALFOUNDRIES development (packaging, interconnect, qualification envelopes, test chip requirements, IO IP, PDK, DM, DfT?)
Define and keep updated technology requirements for each new packaging and interconnect technology
Work cross-functionally with Development, Test, Design, Product management and marketing, and Sales to drive alignment on business, technology requirements, options, and paths to solutions.
Lead market and competitive intelligence for packaging. Participate in industry forums, track industry packaging and interconnect trends, etc. Use data to develop and validate GLOBALFOUNDRIES Packaging strategies.
Business case planning, development and analysis, including R&D and capital invesment, asset utlization planning and analysis of needed investments, value proposition to inform pricing committee and go-to-market approach for marketing collateral
Provide feedback, coaching, and conduct performance reviews for direct reports
Required Qualifications
Minimum 10 yrs experience in leading edge packaging, including, Product management, Package & System Design and People Management
Experience working with technical and sourcing decision-makers at current and potential customers
Experience in assessing new technologies and business opportunities
Experience with memory architectures / impacts on package design
Experience with wide array of packaging technologies
2 or more years leading a semiconductor marketing team
Solid and demonstrated grasp of high-tech marketing best practices: new product definition, new product introduction, marketing campaigns
Comfortable talking about semiconductor design, EDA, IP and end applications
Technical knowledge and ability to engage senior level technical experts internally and externally
An appropriate balance of creative "out of the box thinking" and an understanding of tried and true methods
Experience leading in a globally dispersed environment with team members located in multiple locations and an ability to work in a matrixed environment
A bias toward action, ability to plan effectively and very comfortable working with data
Strong ability to use appropriate influence and persuasion skills
BSEE/BSME or another relevant technical degree
An MSEE or MBA with a marketing concentration are preferred

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